AMD  |  SKU: 100-000000323

AMD EPYC 7413 processor 2.65 GHz 128 MB L3 Tray

€393.45
Shipping calculated at checkout.

Delivery and Shipping

Products shipped within 2 working days from date of order.

Costs

0-24.99kg €14.50

25kg – 50kg €35.00

50kg and Up €60.00

No Customs Charges

Deliveries from Ireland & EU meaning no unwanted customs charges. No hidden charges.

24 cores, 48 threads, 2.65GHz base clock, 3.6GHz boost clock, 128MB L3 cache, 180W TDP

Description

Accelerate Workload Performance
Data centers that require the best CPU performance, security features, and scalability count on

Solution Briefs and White Papers
Find the technical resources you need to learn more about AMD EPYC™.

Where to Buy EPYC™️ Powered Solutions
Find a partner offering AMD EPYC™ Processors and solutions.

AMD Data Center Insights and Updates
Sign up to receive the latest data center news and server content.

AMD Infinity Guard
Help minimize potential attack surfaces as software is booted, executed, and processes your critical data

AMD Infinity Architecture
With architecture, performance, and security leadership, our approach to processor design accelerates the pace of innovation so that you can break through years of data center stagnation.

Specifications

Processor
Processor base frequency 2.65 GHz
Processor manufacturer AMD
Cooler included No
Configurable TDP-down 165 W
Thermal Design Power (TDP) 180 W
Processor cache 128 MB
Processor model 7413
Processor threads 48
Processor boost frequency 3.6 GHz
Component for Server/workstation
Processor family AMD EPYC
Processor cores 24
Processor socket Socket SP3
Configurable TDP-up 200 W
Processor cache type L3
Package type Tray
Memory
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 3200 MHz
Memory channels Octa-channel
Memory bandwidth (max) 204.8 GB/s
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Configurable TDP-down 165 W
Thermal Design Power (TDP) 180 W
Technical details
PCI Express slots version 4.0
Thermal Design Power (TDP) 180 W
Market segment Server
Configurable TDP-up 200 W
Processor cache type L3
Features
Maximum number of PCI Express lanes 128
Thermal Design Power (TDP) 180 W
PCI Express slots version 4.0
Market segment Server
Harmonized System (HS) code 85423119
Processor special features
Configurable TDP-up 200 W
Packaging data
Package type Tray
Logistics data
Harmonized System (HS) code 85423119

Payment & Security

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